Solution
Optimizing Kiln Furniture for Extended Service Life
SiC and mullite-corundum kiln furniture design for high-temperature ceramic firing with optimized microstructure and thermal shock resistance.
The Challenge
Modern oxide ceramics require firing at 1600–1800°C, but SiC-based kiln furniture oxidizes unacceptably above 1600°C. Mullite-corundum alternatives face a difficult tradeoff: high hot bending strength requires dense, well-bonded microstructures, but these often sacrifice thermal shock resistance. Kiln furniture must maintain flatness (tolerances of 0.2% of batt length—just 0.4–0.5mm warpage for substrate-sized batts) while surviving repeated heating and cooling cycles.
The Solution
Four high-alumina refractory types with different bonding systems were compared. Thermal shock resistance was measured by tracking Young’s modulus via resonance frequency before and after 2, 5, and 10 thermal cycles (heating to 950°C, air cooling). Static fatigue testing measured time to failure at 1700°C under 0.1 N/mm² load.
Pure mullite bonding with compact secondary mullite crystals (Type 2) outperformed alumina bonding systems. Type 2 showed initial modulus of 4.4 × 10⁴ N/mm² with only 3% decrease after 10 thermal cycles. In contrast, alumina-bonded Type 1 (modulus 1.5 × 10⁴ N/mm²) lost 17% after 10 cycles—indicating progressive microstructural deterioration.
Results
Figure 7 in the study shows Young’s modulus degradation curves—Types 2 and 4 (both mullite-bonded) maintained modulus through thermal cycling while Type 1 degraded progressively. The key finding: increasing bond phase improves short-term strength but negatively influences long-term performance. Raw materials of high purity are essential—contaminations increase glass phase and lower high-temperature strength.
For production control, resonance frequency measurement of Young’s modulus provides a practical quality check that correlates with service potential. The dependence of static fatigue on bulk density (Fig. 6) reinforces the importance of consistent production monitoring.
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